The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2015

Filed:

Mar. 28, 2012
Applicants:

In-bae Kim, Yongin-si, KR;

Jong-hyun Choung, Hwaseong-si, KR;

Ji-young Park, Hwaseong-si, KR;

Seon-il Kim, Seoul, KR;

Jae-woo Jeong, Incheon, KR;

Sang Gab Kim, Seoul, KR;

Sang-woo Kim, Seongnam-si, KR;

Ki-beom Lee, Seoul, KR;

Dae-woo Lee, Seoul, KR;

Sam-young Cho, Anyang-si, KR;

Inventors:

In-Bae Kim, Yongin-si, KR;

Jong-Hyun Choung, Hwaseong-si, KR;

Ji-Young Park, Hwaseong-si, KR;

Seon-Il Kim, Seoul, KR;

Jae-Woo Jeong, Incheon, KR;

Sang Gab Kim, Seoul, KR;

Sang-Woo Kim, Seongnam-si, KR;

Ki-Beom Lee, Seoul, KR;

Dae-Woo Lee, Seoul, KR;

Sam-Young Cho, Anyang-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 13/00 (2006.01); C23F 1/18 (2006.01); C23F 1/26 (2006.01); H01L 21/3213 (2006.01); C09K 13/08 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
C23F 1/18 (2013.01); C09K 13/08 (2013.01); C23F 1/26 (2013.01); H01L 21/32134 (2013.01); H01L 27/124 (2013.01);
Abstract

An etching composition, a method of forming a metal pattern using the etching composition, and a method of manufacturing a display substrate are disclosed. The etching composition includes about 0.1% by weight to about 25% by weight of ammonium persulfate, about 0.1% by weight to about 25% by weight of an organic acid, about 0.01% by weight to about 5% by weight of a chelating agent, about 0.01% by weight to about 5% by weight of a fluoride compound, about 0.01% by weight to about 5% by weight of a chloride compound, about 0.01% by weight to about 2% by weight of an azole-based compound and a remainder of water. Thus, a copper layer may be stably etched to improve a reliability of manufacturing the metal pattern and the display substrate.


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