The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2015
Filed:
Jul. 13, 2011
Sang Woo Kim, Daejeon, KR;
SE Jin Shin, Daejeon, KR;
Dong Hyun OH, Daejeon, KR;
Kyung Jun Kim, Daejeon, KR;
Sang Woo Kim, Daejeon, KR;
Se Jin Shin, Daejeon, KR;
Dong Hyun Oh, Daejeon, KR;
Kyung Jun Kim, Daejeon, KR;
LG CHEM, LTD., Seoul, KR;
Abstract
In a method for preparing a polyimide resin by reacting diamine and dianhydride, the polyimide resin is polymerized under the presence of a solvent having a boiling point ranging from 130° C. to 180° C. so as to be curable at a low temperature ranging from 150° C. to 250° C. Because the polyimide is curable even at a low temperature, when the polyimide resin is used as an electronic material, damage to equipment due to an otherwise high temperature process can be minimized, and in addition, the polyimide resin can be extensively used as an electronic material such as for a plastic substrate, or the like.