The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9132494 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 15, 2015

Filed:

Jan. 19, 2012
Applicants:

Masahiro Inoue, Konan, JP;

Hajime Saiki, Konan, JP;

Atsuhiko Sugimoto, Kagamigahara, JP;

Inventors:

Masahiro Inoue, Konan, JP;

Hajime Saiki, Konan, JP;

Atsuhiko Sugimoto, Kagamigahara, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); B23K 1/00 (2006.01); B23K 35/26 (2006.01); B23K 35/22 (2006.01); C22C 11/06 (2006.01); C22C 13/00 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
B23K 1/00 (2013.01); B23K 35/22 (2013.01); B23K 35/26 (2013.01); C22C 11/06 (2013.01); C22C 13/00 (2013.01); H01L 21/4853 (2013.01); H01L 21/6835 (2013.01); H01L 23/49811 (2013.01); H01L 24/00 (2013.01); H01L 24/81 (2013.01); H01L 23/49822 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68331 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68386 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/814 (2013.01); H01L 2224/81192 (2013.01); H01L 2924/15174 (2013.01); H01L 2924/15312 (2013.01); H05K 3/4682 (2013.01); H05K 2201/10318 (2013.01);
Abstract

A wiring board and a method for manufacturing the wiring board reinforced by means of a resin is provided. Embodiments of the wiring board allow for reliable attachment of a connection member, like a socket, to a terminal member. For example, a base of terminal pins is put on pin grid array (PGA) terminal pads, and a bonding material paste including solder and an electric insulation material made of a resin is placed on each of the PGA terminal pads. The bonding material paste is then heated to fuse the solder and soften the electric insulation material. Subsequently, the bonding material paste is cooled to solidify the solder and bond each of the bases to a corresponding PGA terminal pad and form an electric insulation surface layer on an exposed surface of each of solder junctions to which the respective bases are bonded.


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