The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2015

Filed:

Mar. 05, 2009
Applicants:

Claudia Pacholski, Stuttgart, DE;

Stefan B. Quint, Stuttgart, DE;

Inventors:

Claudia Pacholski, Stuttgart, DE;

Stefan B. Quint, Stuttgart, DE;

Attorney:
Int. Cl.
CPC ...
C23C 14/04 (2006.01); C23C 18/06 (2006.01); B05D 1/00 (2006.01); B05D 1/32 (2006.01); B82Y 30/00 (2011.01); B82Y 40/00 (2011.01); C23C 18/16 (2006.01); C23C 18/18 (2006.01); C23C 18/44 (2006.01); G01N 21/552 (2014.01);
U.S. Cl.
CPC ...
B05D 1/005 (2013.01); B05D 1/322 (2013.01); B82Y 30/00 (2013.01); B82Y 40/00 (2013.01); C23C 18/1605 (2013.01); C23C 18/1689 (2013.01); C23C 18/1692 (2013.01); C23C 18/1882 (2013.01); C23C 18/44 (2013.01); G01N 21/554 (2013.01); Y10T 428/249978 (2015.04);
Abstract

The present invention relates to highly ordered arrays of nanoholes in metallic films and to an improved method for producing the same. The method according to the invention for producing an highly ordered array of nanoholes in metallic films on a substrate comprises the following steps: a) providing microspheres comprising poly-N-isopropylamide (polyNIPAM), the microspheres being selected from pure poly-N-isopropyl-amide (polyNIPAM) hydrogel microspheres and polymeric or inorganic beads carrying poly-N-isopropylamide (polyNIPAM) hydrogel chains, b) coating an aqueous dispersion of said microspheres onto a substrate and drying the dispersion, which results in a non-close packed ordered array of the microspheres, c) generating a metallic film on the substrate, d) removing the microspheres from the surface of the substrate which results in an ordered array of nanoholes on the substrate, and e) optionally increasing the thickness of the metallic film by selective electroless plating.


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