The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2015

Filed:

Nov. 14, 2012
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Aristotele Hadjichristos, San Diego, CA (US);

Gurkanwal Singh Sahota, San Diego, CA (US);

Steven C Ciccarelli, San Diego, CA (US);

David J Wilding, San Diego, CA (US);

Ryan D Lane, San Diego, CA (US);

Christian Holenstein, La Mesa, CA (US);

Milind P Shah, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 5/00 (2006.01); H05K 3/36 (2006.01); H04B 1/40 (2015.01); H05K 13/04 (2006.01); H01L 23/66 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H05K 3/368 (2013.01); H01L 23/66 (2013.01); H01L 25/16 (2013.01); H04B 1/40 (2013.01); H05K 13/0465 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15321 (2013.01); Y10T 29/49126 (2015.01); Y10T 29/5317 (2015.01);
Abstract

A radio frequency package on package (PoP) circuit is described. The radio frequency package on package (PoP) circuit includes a first radio frequency package. The first radio frequency package includes radio frequency components. The radio frequency package on package (PoP) circuit also includes a second radio frequency package. The second radio frequency package includes radio frequency components. The first radio frequency package and the second radio frequency package are in a vertical configuration. The radio frequency components on the first radio frequency package are designed to reduce the effects of ground inductance.


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