The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2015

Filed:

Dec. 03, 2010
Applicant:

Roland Moedinger, Weinstadt, DE;

Inventor:

Roland Moedinger, Weinstadt, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H05K 3/30 (2006.01); H01R 12/58 (2011.01); H01R 12/72 (2011.01); H01R 13/6587 (2011.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/308 (2013.01); H01R 12/585 (2013.01); H01R 12/724 (2013.01); H01R 13/6587 (2013.01); H05K 1/0245 (2013.01); H05K 1/0251 (2013.01); H05K 2201/09845 (2013.01); H05K 2201/1059 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10401 (2013.01); H05K 2203/0242 (2013.01); Y10T 29/49126 (2015.01);
Abstract

A multipole relief plug-in Connector includes contact elements, the contacting sections of which are arranged in height-offset contact area surfaces, and a multilayer circuit board includes several height-offset contact area surfaces accordingly. In combination, the multipole relief plug-in connector contacts the multilayer circuit board and the multilayer circuit board populates the multipole relief plug-in connector. The contact elements of the relief plug-in connector are designed in the contacting section as press-in contacts for pressing into press-in contact receiving portions of the multilayer circuit board. Contact element receiving portions of the multilayer circuit board are arranged in the contact area surfaces of the multilayer circuit board, the contact element receiving portions being designed as press-in contact receiving portions. A production method produces the multilayer circuit board.


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