The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2015

Filed:

Jun. 07, 2012
Applicants:

Yi-jen LU, Taipei, TW;

Shuo-jen Shieh, Taipei, TW;

Tsung-po Hsu, Taipei, TW;

Inventors:

Yi-Jen Lu, Taipei, TW;

Shuo-Jen Shieh, Taipei, TW;

Tsung-Po Hsu, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20445 (2013.01); H05K 1/0203 (2013.01); H05K 3/284 (2013.01); H05K 7/209 (2013.01); H05K 7/20463 (2013.01); Y10T 29/49126 (2015.01);
Abstract

A circuit board device includes a heat dissipation housing, a circuit board, and a heat conductive adhesive. The heat dissipation housing includes a panel, and at least one end plate connected to one end of the panel and formed with a retaining groove. The circuit board is disposed in the heat dissipation housing spaced apart from the panel and has one end inserted into the retaining groove. The heat conductive adhesive is adhered to the panel and the end plate, and covers the circuit board.


Find Patent Forward Citations

Lu, Yi-Jen. (2015). Circuit board device and manufacturing method thereof and power supply having the circuit board device (U.S. Patent No. 9131628). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9131628

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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