The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2015

Filed:

Oct. 22, 2014
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventor:

Kotaro Shimizu, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01G 4/30 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/248 (2006.01); H01F 27/28 (2006.01); H01L 41/047 (2006.01); H01C 7/00 (2006.01); H01C 1/148 (2006.01); H01C 17/00 (2006.01); H01L 41/22 (2013.01); H01F 41/32 (2006.01); H01G 13/00 (2013.01); H01F 5/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H01C 1/148 (2013.01); H01C 7/008 (2013.01); H01C 17/00 (2013.01); H01F 5/00 (2013.01); H01F 27/2804 (2013.01); H01F 41/32 (2013.01); H01G 4/012 (2013.01); H01G 4/1209 (2013.01); H01G 4/248 (2013.01); H01G 4/30 (2013.01); H01G 13/00 (2013.01); H01L 41/0472 (2013.01); H01L 41/0477 (2013.01); H01L 41/22 (2013.01); H01F 2027/2809 (2013.01);
Abstract

In a multilayer ceramic electronic component, a size of a step portion on a first main surface and a size of a step portion on a second main surface are different from each other. A first outer electrode includes a plating film containing Cu. A length of a portion of the plating film containing Cu that is positioned on the first main surface in a length direction and a length of a portion of the plating film containing Cu that is positioned on the second main surface in the length direction are different from each other.


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