The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2015

Filed:

Apr. 22, 2014
Applicant:

Ngk Spark Plug Co., Ltd., Nagoya-shi, Aichi, JP;

Inventors:

Takahiro Hayashi, Chino, JP;

Makoto Wakazono, Niwa-gun, JP;

Takeshi Toyoshima, Komaki, JP;

Makoto Nagai, Komaki, JP;

Makoto Origuchi, Komaki, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 3/00 (2006.01); H01L 23/00 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/144 (2013.01); H01L 24/05 (2013.01); H05K 3/0014 (2013.01); H05K 3/3452 (2013.01); H05K 3/3489 (2013.01); H05K 2201/099 (2013.01); H05K 2203/0577 (2013.01); H05K 2203/0594 (2013.01);
Abstract

A wiring substrate includes a layered structure including one or more insulating layers and one or more conductor layers; a plurality of connection terminals formed on the layered structure; a first resin layer formed on the layered structure and having (defining) a plurality of first openings through which the connection terminals are respectively exposed; and a second resin layer formed on the first resin layer and having (defining) a plurality of second openings through which the connection terminals are respectively exposed and which are smaller in opening diameter than the first openings, wherein the second resin layer has, around each of the second openings, an inclined surface which is formed such that the distance between the inclined surface and the layered structure decreases toward the second opening.


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