The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2015

Filed:

Feb. 26, 2013
Applicant:

Elite Electronic Material (Kunshan) Co., Ltd, Jiangsu Province, CN;

Inventors:

Rong-Tao Wang, Jiangsu Province, CN;

Tse-An Lee, Tao-Yuan Hsien, TW;

Yi-Jen Chen, Taoyuan County, TW;

Wenjun Tian, Jiangsu Province, CN;

Ziqian Ma, Jiangsu Province, CN;

Wenfeng Lu, Jiangsu Province, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); H05K 1/03 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0353 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); C08L 63/00 (2013.01); B32B 2305/076 (2013.01); B32B 2457/08 (2013.01); H05K 2201/012 (2013.01); H05K 2201/0209 (2013.01); Y10T 428/31529 (2015.04);
Abstract

A halogen-free resin composition includes (A) 100 parts by weight of naphthalene epoxy resin; (B) 10 to 100 parts by weight of styrene maleic anhydride copolymer; and (C) 30 to 70 parts by weight of DOPO-containing bisphenol F novolac resin. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby attain a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high flame retardation, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper clad laminates and printed circuit boards.


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