The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2015
Filed:
Jan. 30, 2012
Mark E. Schlarmann, Austin, TX (US);
Andrew C. Mcneil, Austin, TX (US);
Hemant D. Desai, Austin, TX (US);
Mark E. Schlarmann, Austin, TX (US);
Andrew C. McNeil, Austin, TX (US);
Hemant D. Desai, Austin, TX (US);
FREESCALE SEMICONDUCTOR, INC., Austin, TX (US);
Abstract
An assembly () includes a MEMS die () and an integrated circuit (IC) die () attached to a substrate (). The MEMS die () includes a MEMS device () formed on a substrate (). A packaging process () entails forming the MEMS device () on the substrate () and removing a material portion of the substrate () surrounding the device () to form a cantilevered substrate platform () suspended above the substrate () at which the MEMS device () resides. The MEMS die () is electrically interconnected with the IC die (). A plug element () can be positioned overlying the platform (). Molding compound () is applied to encapsulate the die (), the IC die (), and substrate (). Following encapsulation, the plug element () can be removed, and a cap () can be coupled to the substrate () overlying an active region () of the MEMS device ().