The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2015

Filed:

Jan. 31, 2012
Applicants:

Martin Brandl, Kelheim, DE;

Tobias Gebuhr, Regensburg, DE;

Markus Pindl, Tegernheim, DE;

Albert Schneider, Thalmassing, DE;

Inventors:

Martin Brandl, Kelheim, DE;

Tobias Gebuhr, Regensburg, DE;

Markus Pindl, Tegernheim, DE;

Albert Schneider, Thalmassing, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 33/62 (2010.01); H01L 21/56 (2006.01); H01L 33/00 (2010.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 21/561 (2013.01); H01L 33/0095 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 24/97 (2013.01); H01L 2224/29191 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/83192 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/12041 (2013.01);
Abstract

A leadframe for producing a number of optoelectronic components is specified. At least one mounting region includes a number of chip mounting areas for a number of semiconductor chips. Alongside the mounting region at at least one main area of the leadframe one or more of grooves for reducing mechanical stresses in the leadframe are formed. The groove(s) do not completely penetrate through the leadframe. A method for producing a number of optoelectronic components on a leadframe of this type is furthermore specified.


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