The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2015

Filed:

Dec. 09, 2013
Applicant:

Takeshi Kajiyama, Seoul, KR;

Inventor:

Takeshi Kajiyama, Seoul, KR;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 29/78 (2006.01); H01L 27/22 (2006.01); H01L 29/66 (2006.01); H01L 29/10 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7813 (2013.01); H01L 27/228 (2013.01); H01L 29/1095 (2013.01); H01L 29/66734 (2013.01); H01L 27/10888 (2013.01);
Abstract

According to an embodiment, semiconductor device includes a semiconductor substrate, first and second isolation regions provided in the semiconductor substrate, extending in a first direction, and adjacent to each other, first and second word lines provided in the semiconductor substrate, extending in a second direction crossing the first direction, and adjacent to each other, first and second upper insulating regions provided on the first and second word lines, extending in the second direction, and adjacent to each other, a source/drain diffusion region provided in a surface area of the semiconductor substrate and between the first and second isolation regions, and including a portion positioned between the first and second upper insulating regions, and a first conductive portion provided in the source/drain diffusion region and formed of a material containing metal.


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