The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2015
Filed:
Apr. 15, 2013
Schott Gemtron Corporation, Sweetwater, TN (US);
Eric H. Urruti, Duryea, PA (US);
Schott Corporation, Elmsford, NY (US);
Abstract
A method of forming a through-glass via hole involves providing a glass substrate having first and second substantially planar parallel surfaces; masking the first and second substantially planar parallel surfaces to form a via-patterned portion thereon; and etching the via-patterned portion on the first and second substantially planar parallel surfaces to form a first channel in the first substantially planar parallel surface and a second channel in the second substantially planar parallel surface. The first channel and second channel are substantially orthogonal or non-orthogonal to one another. The first channel and the second channel intersect to form a quadrilateral through-glass via hole having via openings at the first and second substantially planar parallel surfaces. A low cost, low complexity and high reliability method for producing a glass substrate having a plurality of through-glass via holes such that the glass substrate can be used, for example, as an interposer.