The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2015
Filed:
Mar. 25, 2011
Applicants:
Taehyun Kim, Cheonan-si, KR;
Dongsoo Lee, Cheonan-si, KR;
Seok Goh, Cheonan-si, KR;
Kyoungbok Cho, Cheonan-si, KR;
Inventors:
Taehyun Kim, Cheonan-si, KR;
Dongsoo Lee, Cheonan-si, KR;
Seok Goh, Cheonan-si, KR;
Kyoungbok Cho, Cheonan-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-Si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H05K 13/04 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); H01L 21/67144 (2013.01); H05K 13/046 (2013.01); H01L 21/6836 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 24/95 (2013.01); H01L 2221/68336 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/131 (2013.01); H01L 2224/7501 (2013.01); H01L 2224/759 (2013.01); H01L 2224/7565 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75251 (2013.01); H01L 2224/75651 (2013.01); H01L 2224/75744 (2013.01); H01L 2224/75745 (2013.01); H01L 2224/75801 (2013.01); H01L 2224/75821 (2013.01); H01L 2224/81011 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/01074 (2013.01); H05K 1/0269 (2013.01); Y10T 29/53178 (2015.01);
Abstract
An apparatus for mounting a semiconductor device includes a mounting component and a loading component. The mounting component is configured to mount the semiconductor device onto a circuit board. The loading component is disposed adjacent to the mounting component, and is configured to supply the semiconductor device and the circuit board to the mounting component.