The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2015
Filed:
Feb. 19, 2009
Takeshi Tsuno, Kanagawa, JP;
Takayuki Goto, Kanagawa, JP;
Masato Kinouchi, Kanagawa, JP;
Kensuke Ide, Shiga, JP;
Takenori Suzuki, Shiga, JP;
Takeshi Tsuno, Kanagawa, JP;
Takayuki Goto, Kanagawa, JP;
Masato Kinouchi, Kanagawa, JP;
Kensuke Ide, Shiga, JP;
Takenori Suzuki, Shiga, JP;
MITSUBISHI HEAVY INDUSTRIES, Tokyo, JP;
Abstract
A wafer bonding method includes: holding a first substrate with an upper holding mechanismby applying a voltage to the upper holding mechanism; generating a bonded substrate by bonding the first substrate and a second substrate held with a lower holding mechanism; and dechucking the bonded substrate from the upper holding mechanismafter a voltage which attenuates while alternating is applied to the upper holding mechanism. By applying the voltage which attenuates while alternating to the upper holding mechanism, residual attracting force between the bonded substrate and the upper holding mechanismis reduced, thereby enabling the bonded substrate to be dechucked from the holding mechanism more surely in a shorter time period. As a result, the first substrate and the second substrate can be bonded in a shorter time period.