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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9129960 B1

PDFFull Text
Date of Patent:
Sep. 08, 2015

Filed:

Mar. 20, 2014

Semiconductor device and manufacturing method thereof

Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, JP;

Inventor:

Shogo Ogawa, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., , JP;

Attorney:

Rossi, Kimms & McDowell LLP

Primary Examiner:

Sheila V Clark

Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 23/34 (2006.01); H01L 23/50 (2006.01); H01L 23/053 (2006.01); H01L 23/498 (2006.01); H01L 25/07 (2006.01); H01L 23/00 (2006.01); H01L 23/36 (2006.01); H01L 23/373 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/50 (2013.01); H01L 23/053 (2013.01); H01L 23/34 (2013.01); H01L 23/36 (2013.01); H01L 23/3735 (2013.01); H01L 23/49811 (2013.01); H01L 24/80 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/3011 (2013.01);
Abstract

A circuit assembly is disclosed which includes first and second substrates disposed on a heat dissipation base, and first and second semiconductor elements mounted on the first and second substrates. The first and second substrates are wired together, and three main electrode terminals are provided when the first and second semiconductor elements are connected in series, while two main electrode terminals are provided when the first and second semiconductor element are connected in parallel. In both cases, the circuit assembly is covered with a common exterior case so that one portion of each main electrode terminal or one portion of each main electrode terminal is exposed. Parts used in the circuit assembly are shared, and by changing the wiring between the first and second substrates, semiconductor modules with different functions are realized at low cost.

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