The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2015

Filed:

Nov. 27, 2013
Applicant:

Sanyo Electric Co., Ltd., Osaka, JP;

Inventors:

Tetsuya Yamamoto, Osaka, JP;

Ryosuke Usui, Aichi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 23/34 (2006.01); H01L 23/367 (2006.01); H02M 7/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H02M 7/003 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/13091 (2013.01);
Abstract

A semiconductor module has a first substrate and a second substrate placed opposite to the first substrate. A first semiconductor element is provided such that the high-heat main face of the first semiconductor faces the second substrate and is thermally connected to the second substrate via a wiring layer. A second semiconductor element is provided such that the high-heat main face of the second semiconductor faces the first substrate and is thermally connected to the first substrate via another wiring layer. The emitter electrode of the first semiconductor element and the collector electrode of the second semiconductor element are electrically connected to each other via a heat spreader.


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