The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2015
Filed:
Apr. 11, 2013
Applicant:
Sony Mobile Communications Ab, Lund, SE;
Inventor:
Nils Lundberg, Hollviken, SE;
Assignees:
Sony Corporation, Tokyo, JP;
Sony Mobile Communications AB, Lund, SE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/02 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/28 (2006.01); H01L 23/36 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/433 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/34 (2013.01); H01L 23/36 (2013.01); H01L 23/3677 (2013.01); H01L 23/3735 (2013.01); H01L 23/4334 (2013.01); H01L 25/0657 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06565 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/15311 (2013.01);
Abstract
A semiconductor assembly comprises a package, which in turn comprises at least one substrate, a first die stacked onto the substrate, at least one further die stacked onto the first die, at least one heat spreader in the package, and TSV:s extending through the stacked dies. The ends of the TSV:s are exposed at the further die.