The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2015

Filed:

Sep. 23, 2014
Applicant:

Renesas Electronics Corporation, Shimonumabe, Nakahara-ku, Kawasaki-shi, JP;

Inventors:

Mitsuyuki Kubo, Kanagawa, JP;

Junichi Yamada, Kanagawa, JP;

Hiroshi Homma, Kanagawa, JP;

Assignee:

Renesas Electronics Corporation, Kawasaki-shi, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 21/66 (2006.01); G01R 1/04 (2006.01); H01L 23/64 (2006.01); H05K 1/02 (2006.01); H01L 23/31 (2006.01); H01L 23/50 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 22/32 (2013.01); G01R 1/0408 (2013.01); H01L 22/14 (2013.01); H01L 23/642 (2013.01); H05K 1/0231 (2013.01); H01L 23/3128 (2013.01); H01L 23/50 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 24/94 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/451 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/94 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15313 (2013.01);
Abstract

Electrical characteristics of a mounting board over which a semiconductor device is mounted is improved. A mounting board (wiring board) includes a plurality of first through holes and second through holes extending from its upper surface bearing a semiconductor device (semiconductor package) to its lower surface and through-hole wirings formed in the respective through holes. The mounting board has a capacitor arranged on its lower surface and electrically connected with the semiconductor device via second electrodes. Among a plurality of first electrodes formed on the upper surface of the mounting board, the several first electrodes to be connected with the capacitor are connected with one wiring formed in a first through hole with a larger diameter than a signal transmission path.


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