The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2015

Filed:

Nov. 15, 2011
Applicants:

Jovica Savic, Downer's Grove, IL (US);

Zhiping Yang, Cupertino, CA (US);

Jie Xue, San Ramon, CA (US);

LI LI, San Ramon, CA (US);

Inventors:

Jovica Savic, Downer's Grove, IL (US);

Zhiping Yang, Cupertino, CA (US);

Jie Xue, San Ramon, CA (US);

Li Li, San Ramon, CA (US);

Assignee:

Cisco Technology, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/31 (2006.01); H01L 23/24 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3107 (2013.01); H01L 23/24 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A method and apparatus are provided in which a cavity is formed in a support structure, the support structure being operable to support a semiconductor device, disposing at least a portion of a circuit element in the cavity in the support structure, filling the cavity in the support structure with an electrically non-conductive filling material so as to at least partially surround the circuit element with the non-conductive filling material, and electrically connecting the semiconductor device to the circuit element. In an example embodiment, the circuit element is operable to substantially block direct current that is output by the semiconductor device or another semiconductor device.


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