The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2015
Filed:
Aug. 27, 2014
Applicant:
Fuji Electric Co., Ltd., Kawasaki-shi, JP;
Inventor:
Norihiro Nashida, Nagano, JP;
Assignee:
FUJI ELECTRIC CO., LTD., , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H05K 3/32 (2006.01); H05K 3/40 (2006.01); H01L 23/373 (2006.01); H01L 23/433 (2006.01); H01L 23/498 (2006.01); H01L 25/07 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 24/09 (2013.01); H01L 23/3735 (2013.01); H01L 23/4334 (2013.01); H01L 23/49811 (2013.01); H01L 23/49833 (2013.01); H01L 24/01 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 25/072 (2013.01); H05K 3/32 (2013.01); H05K 3/4015 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/11848 (2013.01); H01L 2224/13017 (2013.01); H01L 2224/13019 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13294 (2013.01); H01L 2224/13339 (2013.01); H01L 2224/13347 (2013.01); H01L 2224/13369 (2013.01); H01L 2224/13639 (2013.01); H01L 2224/13644 (2013.01); H01L 2224/13655 (2013.01); H01L 2224/1623 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/16501 (2013.01); H01L 2224/16505 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/81048 (2013.01); H01L 2224/81065 (2013.01); H01L 2224/8184 (2013.01); H01L 2224/81091 (2013.01); H01L 2224/81095 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81359 (2013.01); H01L 2224/81385 (2013.01); H01L 2224/92242 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/1304 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/20105 (2013.01); H01L 2924/20106 (2013.01); H01L 2924/20107 (2013.01); H01L 2924/20108 (2013.01); H01L 2924/35 (2013.01); H05K 3/3436 (2013.01);
Abstract
When a conductive post is bonded to a bonding target member such as a semiconductor chip or an insulating substrate with conductive patterns by using metal nanoparticles, a strong bonding layer can be obtained by forming a bottom surface of the distal end of the conductive post in a concave shape.