The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2015

Filed:

Jun. 28, 2013
Applicant:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Inventor:

Syn-Yem Hu, San Jose, CA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 25/075 (2006.01); H01L 33/60 (2010.01); H01L 33/48 (2010.01); H01L 33/50 (2010.01); F21K 99/00 (2010.01); F21V 7/06 (2006.01); F21Y 101/02 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 33/486 (2013.01); H01L 33/507 (2013.01); H01L 33/60 (2013.01); F21K 9/00 (2013.01); F21V 7/06 (2013.01); F21Y 2101/02 (2013.01); H01L 33/50 (2013.01); H01L 2924/0002 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0091 (2013.01);
Abstract

A light emitting diode (LED) assembly may include an LED semiconductor attached to a first surface of a submount made of optically transparent material. The submount may redirect back side light emitted by the LED semiconductor light away from the LED semiconductor to increase recovery of back side light. The submount may be used with an external bulk reflecting element. The submount may itself include a reflective coating at a second surface opposite from the first surface and be mounted on a reflecting substrate. The submount may include a phosphor forming the first surface or the second surface. The first surface or the second surface may be a textured surface. An array of LED semiconductors may be mounted to the submount. The array of LED semiconductors may be disposed on the submount in an arrangement that optimizes total light output of the LED assembly.


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