The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2015

Filed:

Sep. 13, 2012
Applicants:

Po-yu Wei, Taoyuan Hsien, TW;

Ming-cheng Lee, Taoyuan Hsien, TW;

Yi-lin Chen, Taoyuan Hsien, TW;

Cheng-en Liao, Taoyuan Hsien, TW;

Chia-ming Liu, Taoyuan Hsien, TW;

Chih-ming Chen, Taoyuan Hsien, TW;

Wei-chin Chen, Taoyuan Hsien, TW;

Inventors:

Po-Yu Wei, Taoyuan Hsien, TW;

Ming-Cheng Lee, Taoyuan Hsien, TW;

Yi-Lin Chen, Taoyuan Hsien, TW;

Cheng-En Liao, Taoyuan Hsien, TW;

Chia-Ming Liu, Taoyuan Hsien, TW;

Chih-Ming Chen, Taoyuan Hsien, TW;

Wei-Chin Chen, Taoyuan Hsien, TW;

Assignee:

DELTA ELECTRONICS, INC., Taoyuan Hsien, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/29 (2006.01); H01F 27/30 (2006.01); H01F 17/04 (2006.01);
U.S. Cl.
CPC ...
H01F 17/043 (2013.01); H01F 27/292 (2013.01);
Abstract

A magnetic module includes a magnetic element and a base. The magnetic element includes a conductive assembly and a magnetic core assembly. The conductive assembly includes a plurality of terminals. The magnetic core assembly is partially embedded within the conductive assembly. The base includes a base body and a plurality of conductive structures. The base body has a first surface, wherein the magnetic element is disposed on the first surface. The conductive structures are disposed on the base body and engaged with the plurality of terminals, so that the plurality of terminals are fixed by and electrically connected with the plurality of conductive structures, respectively.


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