The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2015

Filed:

Sep. 21, 2011
Applicants:

Hiroaki Arita, Himeji, JP;

Yoshiki Nakaie, Himeji, JP;

Taiji Yamabe, Tokyo, JP;

Inventors:

Hiroaki Arita, Himeji, JP;

Yoshiki Nakaie, Himeji, JP;

Taiji Yamabe, Tokyo, JP;

Assignee:

DAICEL-EVONIK LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/00 (2006.01); C09D 177/06 (2006.01); B32B 37/04 (2006.01); H01L 23/29 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
C09D 177/06 (2013.01); B32B 37/04 (2013.01); H01L 23/291 (2013.01); H01L 23/293 (2013.01); H05K 3/284 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/12044 (2013.01); H05K 3/281 (2013.01); H05K 2201/0129 (2013.01); H05K 2203/1311 (2013.01); Y10T 156/10 (2015.01); Y10T 428/2896 (2015.01);
Abstract

A film sealant useful for tightly sealing an electric device at a low temperature and a sealing method of using the sealant are provided. The device is covered and sealed by covering at least a region of the device with a film sealant containing a copolyamide-series resin, heat-melting the sealant, and cooling the sealant. The copolyamide-series resin may have a melting point or softening point of 75 to 160° C. and may be a crystalline resin. The copolyamide-series resin may be a multiple copolymer or may contain a unit derived from a long-chain component having a Calkylene group (e.g., a Clactam and an aminoCalkanecarboxylic acid). The film sealant may cover one side of the device.


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