The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2015

Filed:

Mar. 16, 2013
Applicant:

Samsung Display Co., Ltd., Yongin, Gyeonggi-Do, KR;

Inventors:

Min-Woo Lee, Seoul, KR;

Nakcho Choi, Hwaseong-si, KR;

Daeho Song, Hwaseong-si, KR;

WooJae Lee, Yongin-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 37/10 (2006.01); B32B 38/18 (2006.01);
U.S. Cl.
CPC ...
B32B 37/10 (2013.01); B32B 38/1841 (2013.01); B32B 38/1858 (2013.01); B32B 2307/546 (2013.01); B32B 2457/20 (2013.01); Y10T 156/10 (2015.01); Y10T 156/1744 (2015.01);
Abstract

A bonding apparatus configured to bond a component on a substrate is presented. The apparatus includes a stage, a push member, a support member and a compression member. The stage fixes the substrate in place and by using at least one first suction part formed in the stage. The push member is disposed above the stage and pushes the substrate fixed to the stage to support the substrate on the stage. At least one second suction part is formed in the support member to attach to a pad part of the substrate. The compression member compresses the component into the pad part fixed to the support member.


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