The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2015
Filed:
Jan. 09, 2012
Thomas Heckenberger, Leinfelden-Echterdingen, DE;
Stefan Hirsch, Stuttgart, DE;
Florin Moldovan, Stuttgart, DE;
Christoph Fehrenbacher, Stuttgart, DE;
Hans-georg Herrmann, Saarbruecken, DE;
Thomas Heckenberger, Leinfelden-Echterdingen, DE;
Stefan Hirsch, Stuttgart, DE;
Florin Moldovan, Stuttgart, DE;
Christoph Fehrenbacher, Stuttgart, DE;
Hans-Georg Herrmann, Saarbruecken, DE;
MAHLE Behr GmbH & Co. KG, Stuttgart, DE;
Abstract
A method for connecting two components in a fluid-tight manner for producing a fluid-tight unit is provided. The method includes a step of providing at least one first component that is solder-plated on one side, wherein the first component has a cutting burr on a side facing away from the solder-plated surface. The method further includes a step of connecting, in particular soldering, the first component to a second component in a fluid-tight manner, in order to produce the fluid-tight unit, wherein the solder-plated surface of the first component faces the second component when connecting the first and second components in a fluid-tight manner.