The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2015

Filed:

Aug. 29, 2012
Applicants:

Kyle Yeates, Palo Alto, CA (US);

Teodor Dabov, Mountain View, CA (US);

Stephen Brian Lynch, Portola Valley, CA (US);

Inventors:

Kyle Yeates, Palo Alto, CA (US);

Teodor Dabov, Mountain View, CA (US);

Stephen Brian Lynch, Portola Valley, CA (US);

Assignee:

APPLE INC., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 3/32 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 3/323 (2013.01); H05K 3/361 (2013.01); H05K 2201/10371 (2013.01); H05K 2203/0278 (2013.01); Y10T 29/49126 (2015.01); Y10T 156/10 (2015.01);
Abstract

Methods and systems for bonding a flex circuit to a printed circuit board (PCB) using an anisotropic conductive film (ACF) bonding process are disclosed. According to one aspect of the present invention, supports may be attached to an electromagnetic interference (EMI) shielding can in such a way that the EMI shielding can is arranged to support and/or spread forces involved in ACF bonding. The supports may be located proximate to the walls of the EMI shielding can, and positioned such that the supports effectively do not come into contact with components mounted on a PCB along with the EMI shielding can.


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