The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2015
Filed:
Sep. 21, 2012
Applicant:
Nec Corporation, Tokyo, JP;
Inventors:
Takashi Ueda, Tokyo, JP;
Masamoto Tago, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 5/06 (2006.01); H01L 23/10 (2006.01); H01L 23/08 (2006.01); H01L 23/043 (2006.01);
U.S. Cl.
CPC ...
H05K 5/065 (2013.01); H01L 23/10 (2013.01); H01L 23/043 (2013.01); H01L 23/08 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83801 (2013.01);
Abstract
A hollow sealing structure includes a substrate, an element part provided on a first surface of the substrate, a cap that covers the element part, and a resin layer that covers the cap. The substrate includes a positioning part positioning the cap. The cap includes a fixation part being arranged at the positioning part and fixing the cap on the substrate. The resin layer is connected to the positioning part and the fixation part.