The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2015
Filed:
Mar. 14, 2013
Applicants:
Taichi Obara, Tokyo, JP;
Rei Yoneyama, Tokyo, JP;
Hiroyuki Okabe, Tokyo, JP;
Inventors:
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0296 (2013.01); H05K 3/368 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/19107 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10356 (2013.01); Y10T 29/49126 (2015.01);
Abstract
A semiconductor device includes a first printed circuit board, a flat cable having electrical wires and a coating film which covers the electrical wires except for both ends, one end of each of the electrical wires is connected to the first printed circuit board, and a second printed circuit board connected to other end of each of the electrical wires. The flat cable is bent in such a manner that the first printed circuit board and the second printed circuit board face each other. A flat surface is formed in a portion of the coating film.