The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2015

Filed:

Sep. 25, 2013
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Li-Chung Chang, Irvine, CA (US);

Bindu Gupta, San Diego, CA (US);

Timothy Donald Gathman, San Diego, CA (US);

Ibrahim Ramez Chamas, San Diego, CA (US);

Assignee:

Qualcomm Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 3/45 (2006.01); H03H 11/04 (2006.01); H03F 1/02 (2006.01); H03F 1/08 (2006.01); H03F 1/22 (2006.01); H03F 3/193 (2006.01); H03F 3/72 (2006.01);
U.S. Cl.
CPC ...
H03H 11/0466 (2013.01); H03F 1/0277 (2013.01); H03F 1/08 (2013.01); H03F 1/223 (2013.01); H03F 3/193 (2013.01); H03F 3/45183 (2013.01); H03F 3/45475 (2013.01); H03F 3/45932 (2013.01); H03F 3/72 (2013.01); H03F 2200/06 (2013.01); H03F 2200/09 (2013.01); H03F 2200/165 (2013.01); H03F 2200/168 (2013.01); H03F 2200/171 (2013.01); H03F 2200/294 (2013.01); H03F 2200/336 (2013.01); H03F 2200/411 (2013.01); H03F 2200/429 (2013.01); H03F 2200/432 (2013.01); H03F 2200/534 (2013.01); H03F 2200/541 (2013.01); H03F 2200/543 (2013.01); H03F 2203/45352 (2013.01); H03F 2203/45396 (2013.01); H03F 2203/45506 (2013.01); H03F 2203/45511 (2013.01); H03F 2203/45512 (2013.01); H03F 2203/45516 (2013.01); H03F 2203/45521 (2013.01); H03F 2203/45522 (2013.01); H03F 2203/45526 (2013.01); H03F 2203/45528 (2013.01); H03F 2203/45594 (2013.01); H03F 2203/45618 (2013.01); H03F 2203/45702 (2013.01); H03F 2203/45728 (2013.01); H03F 2203/7215 (2013.01); H03F 2203/7221 (2013.01); H03F 2203/7236 (2013.01); H03H 2210/021 (2013.01); H03H 2250/00 (2013.01);
Abstract

Techniques for designing baseband processing circuitry for radio IC's. In an aspect, techniques for differential-to-single-ended conversion in a baseband portion of the IC are disclosed to reduce the pin count and package size for RF IC's. In another aspect, the converter includes selectable narrowband and wideband amplifiers, wherein the wideband amplifiers may be implemented using transistor devices having smaller area than corresponding transistor devices of narrowband amplifiers. Further techniques for bypassing one or more elements, and for implementing a low-pass filter of the converter using an R-C filter network, are described.


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