The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2015

Filed:

Oct. 18, 2012
Applicant:

Taiyo Yuden Co., Ltd., Tokyo, JP;

Inventors:

Noriaki Taniguchi, Kanagawa, JP;

Toshio Nishizawa, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 9/72 (2006.01); H03H 9/64 (2006.01); H03H 9/05 (2006.01); H03H 9/70 (2006.01);
U.S. Cl.
CPC ...
H03H 9/0566 (2013.01); H03H 9/6476 (2013.01); H03H 9/706 (2013.01); H03H 9/725 (2013.01);
Abstract

Provided is a duplexer that can maintain isolation characteristics while being able to independently adjust the input/output ground inductances and the common ground inductance of the double-mode filter. The duplexer includes: a transmitting filter; a receiving filter; a package substrate that includes a first substrate, a die attach layer that is patterned onto the first substrate, a second substrate, and an inner layer located between the first substrate and the second substrate; a double-mode filter that constitutes a portion of the receiving filter; a common ground terminal that makes an input ground and an output ground of the double-mode filter commonly grounded, the common ground terminal constituting a portion of the die attach layer; an input-side ground terminal of the double-mode filter, the input-side ground terminal constituting a portion of the inner layer; and an output-side ground terminal of the double-mode filter, the output-side ground terminal constituting a portion of the inner layer and being formed separately from the input-side ground terminal.


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