The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2015

Filed:

Sep. 30, 2014
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Christoph Eichler, Tegernheim, DE;

Sönke Tautz, Tegernheim, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/00 (2006.01); H01S 5/343 (2006.01); G02B 1/11 (2015.01); H01L 33/58 (2010.01); H01S 5/02 (2006.01); H01S 5/026 (2006.01); H01S 5/20 (2006.01); H01S 5/22 (2006.01); H01S 5/028 (2006.01); H01S 5/323 (2006.01);
U.S. Cl.
CPC ...
H01S 5/34333 (2013.01); G02B 1/11 (2013.01); H01L 33/58 (2013.01); H01S 5/0206 (2013.01); H01S 5/0264 (2013.01); H01S 5/0286 (2013.01); H01S 5/2018 (2013.01); H01S 5/22 (2013.01); H01S 5/0281 (2013.01); H01S 5/32341 (2013.01); H01S 2301/16 (2013.01); H01S 2301/18 (2013.01);
Abstract

An optoelectronic semiconductor laser includes a growth substrate; a semiconductor layer sequence that generates laser radiation; a front facet at the growth substrate and at the semiconductor layer sequence, wherein the front facet constitutes a main light exit side for the laser radiation generated in the semiconductor laser and has a light exit region at the semiconductor layer sequence; a light blocking layer for the laser radiation, which partly covers at least the growth substrate at the front facet such that the light exit region is not covered by the light blocking layer; and a bonding pad at a side of the semiconductor layer sequence facing away from the growth substrate, wherein a distance between the bonding pad and the light blocking layer at least at the light exit region is 0.1 μm to 100 μm.


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