The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2015

Filed:

Apr. 18, 2011
Applicants:

Yuya Dokai, Nagaokakyo, JP;

Nihei Kaishita, Nagaokakyo, JP;

Hiroshi Nonogaki, Nagaokakyo, JP;

Ryohei Goto, Nagaokakyo, JP;

Takahiro Yamaguchi, Nagaokakyo, JP;

Kazuyuki Ikeda, Nagaokakyo, JP;

Inventors:

Yuya Dokai, Nagaokakyo, JP;

Nihei Kaishita, Nagaokakyo, JP;

Hiroshi Nonogaki, Nagaokakyo, JP;

Ryohei Goto, Nagaokakyo, JP;

Takahiro Yamaguchi, Nagaokakyo, JP;

Kazuyuki Ikeda, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01); H01Q 1/22 (2006.01); H01Q 7/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/38 (2013.01); H01Q 1/2225 (2013.01); H01Q 7/00 (2013.01);
Abstract

A wireless IC device includes a substantially rectangular parallelepiped dielectric body, a metal pattern that is provided on the surface of the dielectric body via a film and functions as a radiator, and a wireless IC element coupled to feeding portions of the metal pattern. The dielectric body has a laminated structure including a folded flexible dielectric layer. Surfaces of the dielectric layer which face each other after the dielectric layer has been folded are non-bonded surfaces.


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