The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2015
Filed:
Feb. 28, 2011
Kong Weng Lee, Fort Collins, CO (US);
Kee Yean NG, Penang, MY;
Yew Cheong Kuan, Penang, MY;
Cheng Why Tan, Penang, MY;
Gin Ghee Tan, Penang, MY;
Kong Weng Lee, Fort Collins, CO (US);
Kee Yean Ng, Penang, MY;
Yew Cheong Kuan, Penang, MY;
Cheng Why Tan, Penang, MY;
Gin Ghee Tan, Penang, MY;
Intellectual Discovery Co., Ltd., Seoul, KR;
Abstract
A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive edge interconnecting elements.