The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2015
Filed:
Mar. 15, 2012
Applicants:
Sayaka Takeda, Otsu, JP;
Masao Tomikawa, Otsu, JP;
Inventors:
Sayaka Takeda, Otsu, JP;
Masao Tomikawa, Otsu, JP;
Assignee:
TORAY INDUSTRIES, INC., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 5/07 (2006.01); C08L 63/00 (2006.01); C08L 79/08 (2006.01); H01L 23/29 (2006.01); H01L 23/373 (2006.01); C08G 73/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3737 (2013.01); C08G 73/1039 (2013.01); C08K 5/07 (2013.01); C08L 63/00 (2013.01); C08L 79/08 (2013.01); H01L 23/293 (2013.01); H01L 2924/0002 (2013.01);
Abstract
Disclosed is an epoxy resin composition which has excellent workability and excellent thermal resistance after curing. The epoxy resin composition contains a compound which has a specific imide structure obtained by reacting a diamine having a phenolic hydroxyl group, such as 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (6FAP), with a tetracarboxylic dianhydride, and which has a number average molecular weight of 1,000 to 5,000; and a compound having at least two epoxy groups, such as a bisphenol A type epoxy resin.