The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2015

Filed:

May. 29, 2013
Applicant:

Western Digital Technologies, Inc., Irvine, CA (US);

Inventors:

Richard A. Mataya, Rancho Santa Margarita, CA (US);

Tegan Campbell, Dana Point, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/373 (2006.01); B82Y 10/00 (2011.01); H01L 23/367 (2006.01); H01L 23/42 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/373 (2013.01); B82Y 10/00 (2013.01); H01L 23/3677 (2013.01); H01L 23/3672 (2013.01); H01L 23/3675 (2013.01); H01L 23/3736 (2013.01); H01L 23/42 (2013.01); H01L 23/49855 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73253 (2013.01); Y10S 977/734 (2013.01); Y10S 977/932 (2013.01);
Abstract

An electronic device including a printed circuit board (PCB) including a thermal conduction plane and at least one heat generating component mounted on the PCB and connected to the thermal conduction plane. A frame is connected to the PCB so as to define a first thermally conductive path between at least a portion of the frame and the at least one heat generating component. The electronic device further includes at least one thermally conductive layer between the frame and the at least one heat generating component so as to define a second thermally conductive path between at least a portion of the frame and the at least one heat generating component.


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