The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2015

Filed:

Jul. 29, 2013
Applicant:

Lockheed Martin Corporation, Bethesda, MD (US);

Inventors:

Ryan Michael Hatcher, Swarthmore, PA (US);

Brent M. Segal, Pembroke, MA (US);

Robert Chris Bowen, MountLaurel, NJ (US);

Jonathan Wesley Ward, San Jose, CA (US);

Assignee:

LOCKHEED MARTIN CORPORATION, Bethesda, MD (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14634 (2013.01); H01L 27/1469 (2013.01); H01L 27/14649 (2013.01); H01L 51/0048 (2013.01);
Abstract

An apparatus for infrared imaging may include a hybrid infrared focal plane array including a front-end (FE) portion and a back-end (BE) portion. The FE portion may be coupled to the BE portion via multiple electrically conductive bump bonds. The FE portion may include nano-electronic circuits integrated with an array of infrared imaging pixels. The CNT electronic circuits may be configured to generate multiplexed output signals. The BE portion may include electronic circuits implemented on a substrate and configured to generate readout output signals. A count of the multiple electrically conductive bump bonds may be substantially less than a count of the infrared imaging pixels of the array.


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