The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2015
Filed:
Dec. 16, 2011
Johannes Baur, Regensburg, DE;
Berthold Hahn, Hemau, DE;
Karl Engl, Pentling, DE;
Ann-kathrin Haerle, Deuerling, DE;
Jakob Johannes Haerle, Deuerling, DE;
Johanna Magdalena Haerle, Deuerling, DE;
Joachim Hertkorn, Alteglofsheim, DE;
Tetsuya Taki, Yokohama, JP;
Johannes Baur, Regensburg, DE;
Berthold Hahn, Hemau, DE;
Karl Engl, Pentling, DE;
Volker Haerle, Laaber, DE;
Joachim Hertkorn, Alteglofsheim, DE;
Tetsuya Taki, Yokohama, JP;
OSRAM OPTO SEMICONDUCTORS GMBH, Regensburg, DE;
Abstract
A composite substrate has a carrier and a utility layer. The utility layer is attached to the carrier by means of a dielectric bonding layer and the carrier contains a radiation conversion material. Other embodiments relate to a semiconductor chip having such a composite substrate, a method for producing a composite substrate and a method for producing a semiconductor chip with a composite substrate.