The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2015

Filed:

Mar. 31, 2011
Applicants:

Reona Yokota, Tsukuba, JP;

Koichi Shibayama, Tsukuba, JP;

Akihiro Uenishi, Tsukuba, JP;

Hidenobu Deguchi, Tsukuba, JP;

Tomoki Kunikawa, Tsukuba, JP;

Tatsushi Hayashi, Tsukuba, JP;

Inventors:

Reona Yokota, Tsukuba, JP;

Koichi Shibayama, Tsukuba, JP;

Akihiro Uenishi, Tsukuba, JP;

Hidenobu Deguchi, Tsukuba, JP;

Tomoki Kunikawa, Tsukuba, JP;

Tatsushi Hayashi, Tsukuba, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/16 (2006.01); B32B 27/20 (2006.01); B32B 27/38 (2006.01); C08J 7/00 (2006.01); G11B 5/64 (2006.01); B32B 15/092 (2006.01); C08G 59/40 (2006.01); C08G 59/42 (2006.01); C08G 59/62 (2006.01); C08G 59/68 (2006.01); C08L 63/00 (2006.01); C08K 3/36 (2006.01);
U.S. Cl.
CPC ...
B32B 15/092 (2013.01); B32B 27/20 (2013.01); B32B 27/38 (2013.01); C08G 59/4014 (2013.01); C08G 59/42 (2013.01); C08G 59/621 (2013.01); C08G 59/686 (2013.01); C08J 7/00 (2013.01); C08L 63/00 (2013.01); C08K 3/36 (2013.01); Y10T 428/259 (2015.01); Y10T 428/268 (2015.01);
Abstract

A preliminary-cured material permits reduced surface roughness of a roughening-treated surface, and increase of an adhesive strength between a cured object and a metal layer. The preliminary-cured material is obtained by advancing curing of an epoxy resin material that contains an epoxy resin, a curing agent, and a silica. The preliminary-cured material includes a first principal surface to be roughening-treated, and a second principal surface. The silica includes a first small particle-diameter silica whose particle diameter is not smaller than 0.01 μm but smaller than 0.5 μm, and a second large particle-diameter silica whose particle diameter is not smaller than 0.5 μm but not larger than 20 μm. The first small particle-diameter silica is localized to exist in large quantity on a side of the first principal surface, and the second large particle-diameter silica is localized to exist in large quantity on a side of the second principal surface.


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