The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2015
Filed:
Mar. 15, 2013
Applicants:
Toray Industries, Inc., Tokyo, JP;
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Inventors:
Toshihide Sekido, Otsu, JP;
Kazuaki Kitaoka, Ehime, JP;
Hiroshi Odani, Ehime, JP;
Shigeru Nishiyama, Nagoya, JP;
Masahiko Shimizu, Nagoya, JP;
Assignees:
Toray Industries, Inc., , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 70/44 (2006.01); B29C 45/00 (2006.01); B29C 70/54 (2006.01); B29C 70/68 (2006.01);
U.S. Cl.
CPC ...
B29C 45/0005 (2013.01); B29C 70/443 (2013.01); B29C 70/547 (2013.01); B29C 70/548 (2013.01); B29C 70/68 (2013.01);
Abstract
A method of RTM molding including laminating a plurality of reinforcing fiber materials in a mold to form a reinforcing fiber material laminate, and impregnating a resin into said reinforcing fiber material laminate by injecting a resin in a direction from an end surface of said reinforcing fiber material laminate along a laminate surface while reducing pressure in said mold by evacuation.