The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2015

Filed:

Sep. 14, 2012
Applicants:

Byung-gil Jeong, Anyang-si, KR;

Seog-woo Hong, Yongin-si, KR;

Dong-kyun Kim, Suwon-si, KR;

Seok-whan Chung, Hwaseong-si, KR;

Hyung-jae Shin, Seongnam-si, KR;

Inventors:

Byung-gil Jeong, Anyang-si, KR;

Seog-woo Hong, Yongin-si, KR;

Dong-kyun Kim, Suwon-si, KR;

Seok-whan Chung, Hwaseong-si, KR;

Hyung-jae Shin, Seongnam-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 41/053 (2006.01); B06B 1/02 (2006.01);
U.S. Cl.
CPC ...
B06B 1/0292 (2013.01); Y10T 29/49005 (2015.01);
Abstract

An ultrasonic transducer structure, an ultrasonic transducer, and a method of manufacturing the ultrasonic transducer are provided. The ultrasonic transducer structure includes a driving wafer that includes a driving circuit; and an ultrasonic transducer wafer that is disposed on the driving wafer and includes a first wafer in which a via-hole is formed, a first insulating layer formed on the first wafer, a second wafer spaced apart from the first insulating layer, and a cavity formed between the first insulating layer and the second wafer.


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