The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2015

Filed:

Feb. 21, 2012
Applicant:

Seog-woo Hong, Yongin-si, KR;

Inventor:

Seog-woo Hong, Yongin-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 41/00 (2013.01); B06B 1/02 (2006.01); H01L 41/047 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B06B 1/02 (2013.01); H01L 23/481 (2013.01); H01L 41/047 (2013.01); B32B 2457/14 (2013.01); H01L 24/81 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/81805 (2013.01); H01L 2924/01322 (2013.01); Y10T 156/1056 (2015.01);
Abstract

Electro-acoustic transducers and methods of manufacturing the electro-acoustic transducer are provided. An electro-acoustic transducer includes: a first wafer including a first substrate in which a plurality of electro-acoustic transducer cells are formed; and a second wafer disposed in a lower portion of the first wafer, and including a second substrate in which a plurality of through wafer vias are formed. A method of manufacturing an electro-acoustic transducer includes: forming a plurality of electro-acoustic transducer cells in a first substrate of a first wafer; forming a plurality of through wafer vias in a second substrate of a second wafer; and bonding the first and second wafers to each other.


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