The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2015
Filed:
Mar. 12, 2012
Applicants:
Tomoki Nakao, Saitama, JP;
Koichi Ono, Saitama, JP;
Inventors:
Tomoki Nakao, Saitama, JP;
Koichi Ono, Saitama, JP;
Assignee:
Enplas Corporation, Saitama, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01L 3/00 (2006.01); G01N 27/00 (2006.01); B01J 19/00 (2006.01); B81C 3/00 (2006.01); B01L 7/00 (2006.01); F16L 53/00 (2006.01); G01N 27/403 (2006.01); G01N 27/447 (2006.01); B29C 65/00 (2006.01); B29L 31/00 (2006.01); B29K 707/04 (2006.01); B29C 65/48 (2006.01);
U.S. Cl.
CPC ...
B01L 3/56 (2013.01); B01J 19/0093 (2013.01); B01L 3/502707 (2013.01); B81C 3/001 (2013.01); B01J 2219/00783 (2013.01); B01J 2219/00808 (2013.01); B01J 2219/00833 (2013.01); B01J 2219/00853 (2013.01); B01J 2219/00988 (2013.01); B01L 3/502715 (2013.01); B01L 7/525 (2013.01); B01L 2200/0689 (2013.01); B01L 2300/0645 (2013.01); B01L 2300/0816 (2013.01); B01L 2300/0887 (2013.01); B01L 2300/1827 (2013.01); B01L 2400/0406 (2013.01); B01L 2400/0421 (2013.01); B29C 65/4855 (2013.01); B29C 66/112 (2013.01); B29C 66/114 (2013.01); B29C 66/53461 (2013.01); B29C 66/71 (2013.01); B29C 66/7352 (2013.01); B29K 2707/04 (2013.01); B29L 2031/756 (2013.01); G01N 27/403 (2013.01); G01N 27/44704 (2013.01); G01N 27/44791 (2013.01);
Abstract
The present invention relates to a microchannel chip capable of preventing fluid leakage caused by a lamination defect. Bottomed first regions, second regions, and third regions are formed by joining a film to a lower surface of the chip main body of a microchannel chip. The third regions are in communication with the second regions and are formed on carbon inks. The third regions are formed wider than the carbon inks are. The third regions are filled with an electroconductive adhesive.