The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2015
Filed:
Apr. 11, 2011
Applicant:
Katsuhiro Tomoda, Kanagawa, JP;
Inventor:
Katsuhiro Tomoda, Kanagawa, JP;
Assignee:
SONY CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 3/30 (2006.01); H05K 3/32 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H05K 3/305 (2013.01); H01L 24/73 (2013.01); H01L 24/82 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H05K 3/32 (2013.01); H01L 21/563 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/241 (2013.01); H01L 2224/24011 (2013.01); H01L 2224/24051 (2013.01); H01L 2224/2499 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/25175 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73217 (2013.01); H01L 2224/82002 (2013.01); H01L 2224/82101 (2013.01); H01L 2224/82138 (2013.01); H01L 2224/82143 (2013.01); H01L 2224/82986 (2013.01); H01L 2224/83193 (2013.01); H01L 2224/83871 (2013.01); H01L 2224/9205 (2013.01); H01L 2224/92144 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/12041 (2013.01); H05K 2201/09909 (2013.01); H05K 2201/10106 (2013.01); H05K 2203/072 (2013.01); H05K 2203/1581 (2013.01);
Abstract
An assembly including a substrate, a metal wiring layer on the substrate, the metal wiring layer having an opening therein, a thermosetting resin layer on at least a portion of the substrate overlapping the opening of the metal wiring layer, and a device on the resin layer, the device positioned over the opening of the metal wiring layer and bonded to the substrate via the resin layer.