The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2015
Filed:
Mar. 04, 2013
Applicant:
Quanta Computer Inc., Kuei Shan Hsiang, Tao Yuan Shien, TW;
Inventor:
Li-Cheng Shen, Tao Yuan Shien, TW;
Assignee:
QUANTA COMPUTER INC., Guishan Dist., Taoyuan, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 13/00 (2006.01); H01L 23/13 (2006.01); H01L 25/16 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01L 23/13 (2013.01); H01L 23/49827 (2013.01); H05K 1/182 (2013.01); H05K 1/184 (2013.01); H05K 3/3436 (2013.01); H05K 13/00 (2013.01); H01L 23/3128 (2013.01); H01L 23/49551 (2013.01); H01L 23/49805 (2013.01); H01L 25/16 (2013.01); H01L 2924/0002 (2013.01); H05K 1/117 (2013.01); H05K 3/3426 (2013.01); H05K 2201/10946 (2013.01); H05K 2201/10962 (2013.01); Y10T 29/49147 (2015.01);
Abstract
A printed circuit board assembly is disclosed, including a printed circuit board including at least one opening, and a system in package assembly, wherein the system in package assembly includes a system in package module and a lead frame bonded to the system in package module. The lead frame includes a plurality of pins. The system in package assembly is embedded into the opening of the printed circuit board.