The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2015

Filed:

Sep. 18, 2012
Applicant:

Ticona Llc, Florence, KY (US);

Inventors:

Rong Luo, Florence, KY (US);

Xinyu Zhao, Cincinnati, OH (US);

Ke Feng, Cincinnati, OH (US);

Assignee:

Ticona LLC, Florence, KY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/34 (2006.01); H05K 5/03 (2006.01); C08K 5/372 (2006.01); C08G 75/02 (2006.01); C08K 7/02 (2006.01);
U.S. Cl.
CPC ...
H05K 5/03 (2013.01); C08G 75/029 (2013.01); C08K 5/372 (2013.01); C08K 7/02 (2013.01);
Abstract

An injection molded housing for a portable electronic device is provided. The housing contains a thermoplastic composition that includes a polyarylene sulfide melt processed in the presence of a disulfide compound and a filler. Without intending to be limited by theory, it is believed that the disulfide can undergo a chain scission reaction with the starting polyarylene sulfide to lower its melt viscosity, which can lead to decreased attrition of the filler and thus improved mechanical properties. Due to this ability to reduce viscosity during melt processing, the present inventors have discovered that relatively high molecular weight polyarylene sulfides can be fed to the extruder with little difficulty.


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