logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9119297 B1

PDFFull Text
Date of Patent:
Aug. 25, 2015

Filed:

May. 01, 2013

Electronic component element housing package

Applicant:

Nippon Steel & Sumikin Electronics Devices Inc., Yamaguchi, JP;

Inventor:

Masanori Nagahiro, Yamaguchi, JP;

Assignee:

Nippon Steel & Sumikin Electronics Devices Inc., Yamaguchi, JP;

Attorney:

Nakanishi IP Associates, LLC

Primary Examiner:

Humera Sheikh

Assistant Examiner:

Seth Dumbris

Int. Cl.
CPC ...
B32B 9/00 (2006.01); H05K 5/02 (2006.01); H01L 23/057 (2006.01); H01L 23/498 (2006.01); C04B 35/119 (2006.01); C04B 37/02 (2006.01); B22F 3/22 (2006.01); B22F 7/06 (2006.01); C22C 32/00 (2006.01); H01L 23/10 (2006.01); H01L 23/15 (2006.01);
U.S. Cl.
CPC ...
H05K 5/02 (2013.01); B22F 3/22 (2013.01); B22F 7/06 (2013.01); C04B 35/119 (2013.01); C04B 37/021 (2013.01); C22C 32/0031 (2013.01); C22C 32/0089 (2013.01); H01L 23/057 (2013.01); H01L 23/49822 (2013.01); C04B 2235/3206 (2013.01); C04B 2235/3208 (2013.01); C04B 2235/3225 (2013.01); C04B 2235/3246 (2013.01); C04B 2235/3262 (2013.01); C04B 2235/3263 (2013.01); C04B 2235/3265 (2013.01); C04B 2235/3267 (2013.01); C04B 2235/3418 (2013.01); C04B 2235/96 (2013.01); C04B 2237/343 (2013.01); C04B 2237/403 (2013.01); H01L 23/10 (2013.01); H01L 23/15 (2013.01); H01L 23/49866 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/09701 (2013.01);
Abstract

An electronic component element housing package is produced by firing a ceramic substrate for housing an electronic component element and a metal layer for bonding to the ceramic substrate to form an electrical path, simultaneously in a reducing atmosphere. The ceramic substrate comprises alumina (AlO), a partially stabilized zirconia by forming solid solution with yttria (YO) and a sintering agent. The sintering agent comprises magnesia (MgO), and at least 1 type selected from silica (SiO), calcia (CaO), or manganese oxides (MnO, MnO, MnO, MnO).

Find Patent Forward Citations

Nagahiro, Masanori. (2015). Electronic component element housing package (U.S. Patent No. 9119297). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9119297

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…