The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2015

Filed:

Sep. 05, 2012
Applicants:

Gerard A. Esposito, Chelmsford, MA (US);

Dennis P. Bowler, Sudbury, MA (US);

Inventors:

Gerard A. Esposito, Chelmsford, MA (US);

Dennis P. Bowler, Sudbury, MA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0203 (2014.01); G01J 5/04 (2006.01); H01R 13/24 (2006.01); H01L 31/02 (2006.01); H01R 12/71 (2011.01);
U.S. Cl.
CPC ...
H01R 13/24 (2013.01); G01J 5/045 (2013.01); H01L 31/02002 (2013.01); H01L 31/0203 (2013.01); H01R 12/718 (2013.01);
Abstract

A vacuum compatible high-density electrical interconnect system for use in a vacuum environment is disclosed. In one embodiment, the vacuum compatible high-density electrical interconnect system includes a vacuum compatible base plate, a vacuum compatible printed wiring board (PWB) disposed on the vacuum compatible base plate and a vacuum compatible interposer module disposed in the vacuum compatible base plate. Further, the vacuum compatible PWB includes a plurality of components on a front side of the vacuum compatible PWB and a plurality of associated pads on a back side of the vacuum compatible PWB. In one exemplary embodiment, the vacuum compatible interposer module is disposed in the vacuum compatible base plate such that it operatively connects to the plurality of associated pads on the back side of the vacuum compatible PWB and further operatively connects to a plurality of pads of an external device that is disposed outside the vacuum environment.


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