The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2015

Filed:

Sep. 02, 2014
Applicant:

Panasonic Corporation, Osaka, JP;

Inventors:

Katsuyuki Nagahama, Hyogo, JP;

Yuya Yamamoto, Osaka, JP;

Kentaro Yamauchi, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/00 (2006.01); H01L 33/60 (2010.01); H01L 27/15 (2006.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 27/153 (2013.01); H01L 33/58 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01);
Abstract

The light-emitting device of the disclosure includes at least one LED chip and a mounting substrate. The mounting substrate includes: a ceramic substrate; a reflection layer situated on a second surface on the opposite side of the ceramic substrate from a first surface; and a gas barrier layer covering the reflection layer. The LED chip is bonded to the first surface of the ceramic substrate. The ceramic substrate has light diffusion and transmissive properties and has a plan size larger than a plan size of the LED chip. The reflection layer has a plan size smaller than a plan size of the ceramic substrate and is formed so as to cover an area larger than a projected area of the LED chip on the second surface of the ceramic substrate.


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